HIAG Immobilien Holding AG has consistently pursued its financing strategy with the successful placement of its third Green Bond of CHF 100 million. The issue, which has a term of six years, was placed at a coupon of 1.30 percent. The bond is scheduled for settlement on 15 September 2026. This measure serves to finance and refinance projects and existing buildings that meet the criteria of HIAG's Green Financing Framework, underscoring the company's commitment to sustainable development in the real estate sector.
The transaction follows the publication of HIAG's positive half-year results. It is an element of the company's strategic alignment, which aims to optimise the capital structure through sustainable financing instruments. With its third Green Bond, HIAG secures the currently attractive interest rate level for the long term and contributes to creating a balanced maturity profile within its financing portfolio.
Details of the Issue and Parties Involved
Several established financial institutions acted as Joint Lead Managers for the execution of the issue. These were Zürcher Kantonalbank, Raiffeisen Schweiz and Bank J. Safra Sarasin AG. The role of these partners was crucial for the smooth and successful placement of the bond on the market.
- —Issuer: HIAG Immobilien Holding AG
- —Volume: CHF 100 million
- —Term: 6 years
- —Coupon: 1.30 percent
The application for trading the Green Bond on the SIX Swiss Exchange has already been submitted, which further increases accessibility and liquidity for investors. This listing enables a wider range of investors to participate in the sustainable activities of HIAG Immobilien Holding AG.
The strategic decision to issue a third Green Bond reflects the endeavour to align long-term capital resources with corporate objectives. A particular focus is placed on ecological and sustainable aspects within the real estate portfolio. This not only builds investor confidence but also continues to position HIAG as an actor driving responsible development in the Swiss real estate market.
